SYNOVA

SYNOVA S.A., headquartered in Duillier, Switzerland specializes in the production of advanced laser cutting systems with unique Laser MicroJet® technology, which combines waterjet guidance with laser precision. SYNOVA was founded in 1997 by Bernold Richerzhagen, who developed the technology at EPFL, SYNOVA can help you solve key problems in traditional cutting methods, enhancing precision machining in many other industries together.

With subsidiaries in the US, Japan, India, Korea, Germany and China, SYNOVA has 140 employees, including 30 engineers focused on research and development. Their facility in Duillier assembles and tests up to 100 machines per year. The company’s technology plays a key role in semiconductor slicing and diamond cutting, leading to the creation of three business units: Diamond, Semiconductor and Metal Industries.

SYNOVA cooperates with major manufacturers such as Makino and research organizations such as Fraunhofer ILT and Carl Zeiss Jena, ensuring continuous innovation and global customer support.

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Laser Water Jet Cutting machine LCS 800

Main applications include machining of semiconductor equipment sub-assemblies, metal masks and other components made of metal, ceramics or composites (e.g. silicon carbide, CFRP).

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Laser Water Jet Cutting machine LCS 303

The machine with a working area of 300 x 300 mm uses linear motor axes. The work piece is fixed on a T-Nut table. An optional B rotary axis can be mounted on the table allowing to position the work piece with a different rotation angle.

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Laser Water Jet Cutting machine LCS 305

Fully automatic offset calibration system integrates laser nozzle alignment, automatic jet angle calibration, laser power meter and touch probe.

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Laser Water Jet Cutting machine LCS 50

This machine is designed for machining industrial diamond tools and other small parts requiring precision cutting, drilling, grooving or slicing.

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