LASER SOURCE COHERENT DIAMOND E SERIES

Laser source Diamond E-1000 Series are sealed, pulsed CO2 lasers offering maximum powers up to 1 kW in a fully integrated and compact package.

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APPLICATION

INDUSTRIES
Automative
Electronics – Semiconductor
FUNCTION
Laser cutting / laser micro cutting
Laser engraving
MATERIAL
Acrylic, Crystal, Paper
Wood
Glass
Leather

PRODUCT DESCRIPTION

PRODUCT INTRODUTION

Laser source Diamond E-1000 Series are sealed, pulsed CO2 lasers offering maximum powers up to 1 kW in a fully integrated and compact package. By incorporating the RF power supply within the laser head the E-Series completely eliminates the RF umbilical increasing laser reliability and simplifying integration into a workstation or robotic tool.

Available at both 10.6 µm and 9.4 µm wavelengths, the unique, E-1000 Series design packs a host of high performance features making it uniquely suited for use in space-sensitive applications.

The application such as: cutting, engraving, perforating and drilling of paper, plastic films, plastics, glass, carbon composites, textiles, wood and even thin metals. The RF power supply is detachable and a full suite of on-board diagnostics (accessible via the Internet) is available that allows for proactive maintenance.

This makes it useful for processing a broad mix of materials, ranging from metals and plastics, to organic materials like leather, textiles, or wood. Rapid switching between jobs without the downtime of lengthy setup supports economical production of lot sizes from single units to volumes of over 1000 pieces.

 

FEATURES

 

SPECIFICATION

*The specifications can be changeable.

 

 

SALIENT FEATURES

  • Wide operating power range
  • Typical peak power >3 kW
  • Pulse frequency from single-shot to 200 kHz
  • Fast rise/fall time
  • Outstanding beam quality
  • Excellent power stability
  • Low-cost OEM configuration
  • Integrated but detachable RF power supply
  • Compact design
  • Equipped with on-board internet accessible diagnostics
  • High Speed Digital ConvertingThrough-cutting, Kiss-cutting, and Perforation

 

APPLICATIONS

  • Engraving
  • Die Board Cutting
  • Glass Cutting and Thermal Processing
  • Ceramic Drilling and Scribing
  • Automotive
  • 3D Printing
  • Semiconductor Processing

 

CATALOGUE

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