Laser Water Jet Cutting machine LCS 303

Laser Water Jet Cutting machine LCS 303

The 3-axis LCS 303 with water jet guided laser technology (Laser MicroJet®) is a highly accurate and reliable laser
cutting system. It can process a wide variety of materials, from metals to ultra-hard and brittle materials such as diamond or ceramic, to complex composites. Applications include high precision machining of watch components, medical devices and tools, electronic and other high-tech parts.

The machine with a working area of 300 x 300 mm uses linear motor axes. The work piece is fixed on a T-Nut table. An optional B rotary axis can be mounted on the table allowing to position the work piece with a different rotation angle. The state-of-the-art CNC machine system includes a high-power green laser, a compact high pressure water pump with an ultra-pure water unit, a touch-screen control panel and a vision system with motorized zoom. The automated offset calibration system integrates laser-nozzle alignment, jet angle correction, laser power measurement and jet stability control (all optional).

Công nghệ Synova Laser MicroJet®

The Laser MicroJet® is a hybrid method of machining, which combines a laser with a “hair-thin” water jet that precisely guides the laser beam by means of total internal reflection in a manner similar to conventional optical fibers. The water jet continually cools the cutting zone and efficiently removes.

The water jet continuously cools the cutting area and effectively removes parts. As a “cold, controlled laser,” Synova’s LMJ technology addresses key issues associated with dry lasers such as heat damage, debris mitigation, taper and lack of true precision.

Materials & Operations

Metals: Stainless steel, Durnico, Phynox, CuBe, copper, brass, gold, aluminium, shape-memory alloys (Nitinol, cobalt-chrome), titanium, nickel, superalloys etc.

Ultra-hard materials: Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), CVD diamond, natural diamond, tungsten carbide (WC).

Ceramics & Composites: Silicon carbide (SiC), silicon nitride, (SiN), ceramic-matrix composites (CMCs), CFRP, Zirconia, (ZrO2), HTCC/LTCC, aluminium nitride (AlN), aluminium oxide (Al2O3).

Operations

2D cutting, drilling, slicing, slotting, grooving, trenching, milling, engraving, profiling.

Specifications